Replacement end time determination method, substrate processing method, and substrate processing apparatus
AssigneeSCREEN Holdings Co., Ltd.
InventorNoritake SUMI
Life of this patent
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Abstract
In a replacement end time determination method in accordance with the present invention, in a dry state where a liquid to be replaced is not present in a chamber, a processing fluid is supplied and discharged in accordance with a predetermined supply/discharge recipe, and while the processing fluid is maintained in a supercritical state, a density profile is acquired to be used as a reference profile. A difference between the density profile acquired in a wet state where the liquid to be replaced is present in the chamber and the reference profile is accumulated, and on the basis of a comparison between the accumulated value and a threshold value set for the accumulated value, a replacement end time is determined.
Claims10
A replacement end time determination method in a process of replacing a liquid to be replaced by a processing fluid in a supercritical state in a chamber, the replacement end time determination method comprising:
- maintaining the processing fluid in the chamber in the supercritical state by supplying and discharging the processing fluid into and from the chamber in which the liquid to be replaced is present in accordance with a predetermined supply/discharge recipe for filling an inside of the chamber with the processing fluid in the supercritical state;
- detecting a density of the processing fluid discharged from the chamber and accumulating a difference between a detection value at each time and a value indicated by a reference density profile acquired in advance;
- and
- determining whether or not replacement of the liquid to be replaced by the processing fluid is ended, on a basis of an accumulated value and a threshold value acquired in advance, wherein
- the reference density profile is acquired as a density profile representing a time change of the density, which is acquired by detecting the density of the processing fluid in the chamber while supplying and discharging the processing fluid into and from the chamber in accordance with the supply/discharge recipe in a state where the liquid to be replaced is not present in the chamber.
A substrate processing method, comprising:
- accommodating a substrate with a liquid to be replaced adhering thereto in a chamber;
- maintaining a processing fluid in the chamber in a supercritical state by supplying and discharging the processing fluid into and from the chamber in accordance with a predetermined supply/discharge recipe for filling an inside of the chamber with the processing fluid in the supercritical state;
- detecting a density of the processing fluid discharged from the chamber;
- accumulating a difference between a detection value at each time and a value indicated by a reference density profile acquired in advance;
- determining whether replacement of the liquid to be replaced by the processing fluid is ended or not on a basis of an accumulated value and a predetermined threshold value;
- and
- drying the substrate by discharging the processing fluid and decompressing the inside of the chamber when it is determined that the replacement is ended, wherein
- the reference density profile is acquired as a density profile representing a time change of the density, which is acquired by detecting the density of the processing fluid in the chamber while supplying and discharging the processing fluid into and from the chamber in accordance with the supply/discharge recipe in a state where the liquid to be replaced is not present in the chamber.
Dependencies are inferred from the claim text.