Plating apparatus and plating method

Abstract

Provided are a plating apparatus and the like capable of improving the uniformity of a plating film formed on a substrate. The plating apparatus includes a plating tank, a substrate holder for holding a substrate, an anode holder disposed in the plating tank to face the substrate held in the substrate holder, the anode holder being configured to hold a soluble anode, an anode mask attached to the anode holder, the anode mask having an opening through which a current flowing between the anode and the substrate passes, an adjustment mechanism configured to adjust an opening dimension of the anode mask, and a controller that controls the adjustment mechanism based on an amount of electrolysis in the anode while the anode is in use.

Dependencies are inferred from the claim text.