Curable Compositions for Composite and Tool Release
AssigneeHenkel IP & Holding GmbH
InventorsZhongwei Liu, Christopher Verosky, Kevin Welch, Daniel Yi, Chih-Min Cheng
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AssigneeHenkel IP & Holding GmbH
InventorsZhongwei Liu, Christopher Verosky, Kevin Welch, Daniel Yi, Chih-Min Cheng
Estimating the term…
The present disclosure relates generally to two part adhesive compositions comprising a resin part including a curable resin selected from multifunctional, hydroxyl di-terminated polymer having alkene segments and epoxide segments in the polymer chain; an epoxy di-terminated block copolymer having siloxane moieties and bisphenol A moieties in the backbone and combination thereof and a hardener part including a curative for the curable resin. When mixed the compositions cure to a form that provides hardness but relatively low bond strength to a substrate and which can be removed from metal and other surfaces easily and simply with little residue.
A curable, two component, mold blocking material, including:
(canceled)
Dependencies are inferred from the claim text.