Substrate for liquid droplets
AssigneeLpkf Laser & Electronics AG
InventorsRobin Krüger, Malte Schulz-Ruhtenberg, Oktavia Ostermann, Bernd Rösener
Life of this patent
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Abstract
The invention provides a carrier in the form of a glass plate having recesses formed therein which extend through the full thickness of the carrier and whose opposing terminal cross-sections are open in the plane of the opposing surfaces of the glass plate. The recesses therefore form through-holes through the glass plate and have an inside diameter of 5 to 1000 μm.
Claims39
A method of treating liquid droplets comprising;
- of introducing droplets of at least one liquid into recesses of a first glass plate extending through the full thickness of the first glass plate and having an inner diameter of 5 to 1000 μm and the recesses tapering in a V-shape or the inner diameter tapering from the terminal cross-sections, which lie in the plane of the opposing surfaces of the first glass plate, to a smaller inner diameter which lies at a spacing from the planes of the surfaces of the first glass plate.
(canceled)
Use of a first glass plate having recesses extending through the full thickness of the first glass plate and having an inner diameter of 5 to 1000 μm and the recesses tapering in a V-shape, or the inner diameter tapering from the end cross-sections lying in the plane of the surfaces of the first glass plate facing each other to a smaller inner diameter which is at a spacing from the planes of the surfaces of the first glass plate, as a holding device for liquid droplets held in the recesses, wherein the walls of the recesses are hydrophilic and optionally at least one of the surfaces of the first glass plate is hydrophobically coated.
A process for producing a carrier having a first glass plate with recesses for receiving liquid droplets, in which the recesses are produced by spot irradiation of an original first glass plate with a laser beam and subsequent etching of the first glass plate up to an inner diameter of the recesses of 5 to 1000 μm and until the recesses extend through the entire thickness of the first glass plate, the etching being performed until the first glass plate has a thickness of 100 to 1000 μm, etching the first glass plate being performed until the inner diameter of the recesses tapers from the terminal cross sections lying in the plane of the opposing surfaces of the first glass plate to a smaller inner diameter lying at a spacing from the planes of the surfaces of the first glass plate, and after the etching, optionally at least one surface of the first glass plate is coated with a hydrophobic coating.
Dependencies are inferred from the claim text.