Apparatus and method for controlling substrate polish edge uniformity

An apparatus for processing a substrate, comprising:

• a platen;
• a pad disposed on the platen, the pad having a pad radius extending from a central axis;
• a carrier assembly disposed on the pad having a carrier radius that extends from a rotational axis of the carrier assembly;
• a first fluid delivery arm configured to provide a first fluid to a first point on the pad;
• and
• a second fluid delivery arm configured to provide a second fluid to a second point on the pad, the second point disposed a radial distance from the central axis, the radial distance being greater than about 75% of the pad radius.

A method of polishing a substrate comprising:

• urging a substrate against a surface of a pad of a polishing system using a carrier assembly, wherein the pad has a pad radius and a central axis from which the pad radius extends;
• translating the carrier assembly across a surface of the pad while rotating the carrier assembly about a rotational axis;
• dispensing a first fluid onto the pad from a first fluid nozzle at a first flow rate, wherein the first fluid is delivered to the pad at a second radial distance that is measured from the central axis;
• and
• dispensing a second fluid onto the pad from a second fluid nozzle at a second flow rate, wherein the second fluid is delivered to the pad at a third radial distance that is measured from the central axis, such that the third radial distance is greater than the second radial distance.