Method for conditioning polishing tool, substrate processing method, and substrate processing device

A substrate processing method, comprising:

• a substrate rotation process, holding a silicon dummy substrate having a main surface in a non-mirror state in a horizontal posture and rotating the dummy substrate about a vertical axis;
• a conditioning execution process, executing conditioning of the polishing tool by bringing the polishing tool into contact with the main surface of the dummy substrate that is being rotated, wherein the polishing tool has a resin body in which abrasive grains are dispersed;
• and
• a polishing process, polishing a back surface of a production substrate by using the polishing tool on which the conditioning is performed.

A substrate processing device, comprising a holding and rotating part, holding a silicon dummy substrate having a main surface in a non-mirror state in a horizontal posture and rotating the dummy substrate about a vertical axis;

• a polishing tool, having a resin body in which abrasive grains are dispersed;
• a polishing tool movement mechanism, moving the polishing tool;
• and
• a control part, controlling substrate processing,
• wherein the control part executes conditioning of the polishing part by bringing the polishing tool into contact with the main surface of the dummy substrate being rotated by the holding and rotating part by using the polishing tool movement mechanism.