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US 2024/0253158 A1Published application
Laser processing apparatus and method of manufacturing semiconductor device
AssigneeMitsubishi Electric Corporation
InventorsRyo KAMOSHIDA, Tamio MATSUMURA
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Abstract
A laser processing apparatus includes a stage having a wafer holding surface, a laser irradiation mechanism, and a nozzle. On the wafer holding surface, a semiconductor wafer having a first surface and a second surface opposite to the first surface is disposed such that the wafer holding surface faces the second surface. The laser irradiation mechanism applies a laser beam from a first surface side. The nozzle supplies a liquid from a second surface side.
Claims12
A laser processing apparatus comprising:
- a stage having a wafer holding surface;
- a laser irradiation mechanism;
- and
- a nozzle, wherein
- on the wafer holding surface, a semiconductor wafer having a first surface and a second surface opposite to the first surface is disposed such that the wafer holding surface faces the second surface,
- the laser irradiation mechanism applies a laser beam from a first surface side, and
- the nozzle supplies a liquid from a second surface side.
4 more elements
A method of manufacturing a semiconductor device, the method comprising:
- preparing a semiconductor wafer having a first surface and a second surface opposite to the first surface, the semiconductor wafer having an outer circumferential portion and an inner circumferential portion located inside the outer circumferential portion;
- processing the second surface located at the inner circumferential portion to be recessed toward the first surface;
- disposing the semiconductor wafer on a wafer holding surface of a stage such that the second surface faces the wafer holding surface;
- and
- applying a laser beam from a first surface side while supplying a liquid from a second surface side, to separate the outer circumferential portion from the semiconductor wafer.
2 more elements
Dependencies are inferred from the claim text.