Loading patent…
AssigneeSony Group Corporation
InventorsHIROYUKI HOSONO, YUTAKA SUGIYAMA, KEIJI JITSUKAWA, KENTARO SAWADA, DAISUKE MOTEKI, YUSUKE KAJIO
Estimating the term…
To provide a laser soldering apparatus, a control apparatus, and a laser soldering method that are capable of performing high-quality soldering by laser irradiation. A laser soldering apparatus according to the present technology includes a laser light source, a spatial light modulator (SLM), and a control unit. The laser light source emits laser light. The SLM modulates the laser light incident from the laser light source and irradiates at least one of a solder or a soldering target object with the laser light. The control unit controls the laser light source and the SLM to adjust an irradiation condition of the laser light.
A laser soldering apparatus, comprising:
A control apparatus, comprising
A laser soldering method, comprising:
Dependencies are inferred from the claim text.