Substrate processing method
AssigneeSCREEN Holdings Co., Ltd.
InventorsYuji TANAKA, Masaya ASAI, Masahiko HARUMOTO, Koji KANEYAMA
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Abstract
A coating liquid containing metal as a metal-containing coating liquid is supplied to a surface to be processed of a substrate by a coating processing unit, whereby a metal-containing coating film is formed on the surface to be processed. The substrate on which the metal-containing coating film has been formed is transported to a metal removal unit by a transport mechanism. A removal liquid for dissolving the metal is supplied to a peripheral portion of the substrate by the metal removal unit such that the metal-containing coating film remains in a region except for the peripheral portion of the surface to be processed of the substrate.
Claims10
A substrate processing method including the steps of:
- forming a metal-containing coating film on a surface to be processed by supplying a coating liquid containing metal as a metal-containing coating liquid to the surface to be processed of a substrate by a film formation unit;
- transporting the substrate on which the metal-containing coating film has been formed to a peripheral portion removal unit by a transport mechanism;
- and
- supplying a first removal liquid for dissolving the metal to a peripheral portion of the substrate by the peripheral portion removal unit such that the metal-containing coating film remains in a region except for the peripheral portion of the surface to be processed of the substrate.
The substrate processing method according to claim, 7, wherein
- the development nozzle and the first removal liquid nozzle are constituted by a common nozzle.
Dependencies are inferred from the claim text.