Ai enhanced, self correcting and closed loop smt manufacturing system

A surface mount technology (SMT) manufacturing system for fabricating printed circuit board assemblies (PCBAs), said system comprising:

• a screen printer for depositing solder paste on conductive solder pads on a printed circuit board (PCB);
• a solder paste inspection (SPI) sub-system for inspecting the solder paste deposited on the PCB to identify defects;
• a pick-and-place machine for placing circuit components on the solder paste;
• a first automated optical inspection (AOI) sub-system for inspecting the PCB after the circuit components are placed on the PCB;
• a reflow soldering oven for bonding component leads both electrically and mechanically to the pads on the PCB;
• a second AOI sub-system for inspecting the PCB after the PCB has been to the reflow soldering oven;
• an auto-insertion machine for inserting additional components on the PCB that are not able to be placed by the pick-and-place machine;
• a wave solder machine for bulk soldering the PCB;
• an in-line X-ray inspection machine for performing an X-ray inspection process on the PCB;
• an in-circuit testing machine for performing electrical testing on the PCB;
• and
• an artificial intelligence (AI)/machine learning (ML) analysis engine responsive to process data and variables from each of the screen printer, the SPI sub-system, the pick-and-place machine, the first AOI sub-system, the reflow soldering oven, the second AOI sub-system, the auto-insertion machine, the wave solder machine, the in-line X-ray inspection machine and the in-circuit testing machine and providing feedback signals to each of the screen printer, the SPI sub-system, the pick-and-place machine, the first AOI sub-system, the reflow soldering oven the second AOI sub-system, the auto-insertion machine, the wave solder machine, the in-line X-ray inspection machine and the in-circuit testing machine for self-correction purposes.