Semiconductor module

A semiconductor module comprising:

• a plurality of semiconductor devices including respective semiconductor elements and respective signal terminals extending in a first direction, the semiconductor elements being electrically connected to the signal terminals, respectively;
• a heat sink located opposite from the signal terminals with respect to the semiconductor elements in the first direction, the heat sink supporting the plurality of semiconductor devices;
• a plurality of first wiring boards that are located opposite from the heat sink with respect to the semiconductor elements in the first direction, and that are electrically connected to the signal terminals of the semiconductor devices, respectively;
• a second wiring board electrically connected to the plurality of first wiring boards;
• and
• a plurality of communication wirings electrically connecting the plurality of first wiring boards and the second wiring board,
• wherein the plurality of first wiring boards are provided with first protection circuits configured to suppress application of overvoltage to the semiconductor elements,
• the signal terminal of one of the plurality of semiconductor devices is press-fitted into one of the plurality of first wiring boards in the first direction, and
• the plurality of communication wirings are displaceable in a direction perpendicular to the first direction.