Method for protecting reactive materials with atomically thin film
OwnerMelissa A. Hines, William J.I. De Benedettiinventors
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Abstract
A method of forming a multi-layer structure comprising may include a step of providing a substrate, a step of depositing a protection layer, a step of depositing a thin film material, and a step of detaching. The substrate may have a low surface energy surface or a low surface energy coating or modification disposed on at least a portion of a substrate to form a low surface energy surface. The step of depositing a protection layer may be performed on at least a portion of the low surface energy surface. The step of detaching may detach the multi-layer structure from the substrate
Claims20
A method of forming a multi-layer structure comprising:
- i) providing a substrate having a low surface energy surface;
- ii) depositing a protection layer on at least a portion of the low surface energy surface, wherein the protection layer is atomically thin and/or atomically smooth;
- iii) depositing one or more thin film materials on the protection layer to provide one or more layers of thin film materials;
- and
- iv) detaching the multi-layer structure from the substrate;
- wherein the multi-layer structure comprises the protection layer and the one or more layers of thin film materials.
A multi-layer structure comprising:
- i) a protection layer;
- and
- ii) one or more layers of one or more thin film materials;
- wherein the protection layer is atomically thin and/or atomically smooth in a local surface area as observed by visual inspection, optical microscope, AFM, electron microscope, or any combination thereof.
Dependencies are inferred from the claim text.