Back to results
US 2024/0231237 A9Published application
Treatment liquid, method for washing substrate, and method for removing resist
AssigneeFUJIFILM Corporation
InventorsTomonori TAKAHASHI, Tetsuya KAMIMURA
Life of this patent
Estimating the term…
Abstract
A treatment liquid for a semiconductor device includes an alkanolamine; a hydroxylamine; an organic solvent; Ca; Fe; and Na, wherein the content of the alkanolamine in the treatment liquid is 0.1% to 5% by mass, the content of the hydroxylamine in the treatment liquid is 0.1% to 30% by mass, and each of the mass ratio of Ca, Fe, and Na with respect to the content of the alkanolamine and the hydroxylamine in the treatment liquid is 10−12 to 10−4.
Claims21
A treatment liquid for a semiconductor device, comprising:
- an alkanolamine;
- a hydroxylamine;
- an organic solvent;
- Ca;
- Fe;
- and
- Na,
- wherein the content of the alkanolamine in the treatment liquid is 0.1% to 5% by mass, the content of the hydroxylamine in the treatment liquid is 0.1% to 30% by mass, and
- each of the mass ratio of Ca, Fe, and Na with respect to the content of the alkanolamine and the hydroxylamine in the treatment liquid is 10−12 to 10−4.
6 more elements
Dependencies are inferred from the claim text.