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US 2024/0230248 A1Published application
3d printed cold plates and methods for cooling power devices embedded in 3d printed circuit boards
AssigneeToyota Motor Engineering & Manufacturing North America, Inc.
InventorsFeng Zhou, Ercan Dede
Life of this patent
Estimating the term…
Abstract
A method includes printing, using a 3D printer, a cold plate, printing, using a 3D printer, an electrical insulation layer embedded in a top surface of the cold plate, and printing, using a 3D printer, a conductor substrate embedded in the electrical insulation layer embedded in the top surface of the cold plate.
Claims20
A method comprising:
- printing, using a 3D printer, a cold plate;
- printing, using a 3D printer, an electrical insulation layer embedded in a top surface of the cold plate;
- and
- printing, using a 3D printer, a conductor substrate embedded in the electrical insulation layer embedded in the top surface of the cold plate.
1 more element
A method comprising:
- printing, using a 3D printer, a cold plate having a hollow interior recess and a plurality of fins positioned in the hollow interior recess;
- fabricating an electrical insulation layer;
- fabricating a conductor substrate and bonding the conductor substrate to the electrical insulation layer;
- fabricating a power device and bonding the power device to the conductor substrate;
- and
- bonding the power device, conductor substrate, and electrical insulation layer to the cold plate, such that the power device, conductor substrate, and electrical insulation layer are embedded into a top surface of the cold plate.
3 more elements
Dependencies are inferred from the claim text.