Cleaning operations based on deposition thickness
AssigneeApplied Materials, Inc.
InventorsVictor Zamarian, Mitesh Harshad Sanghvi, Venkatanarayana Shankaramurthy, Yuhyuk Cho, Deepesh Rai
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Abstract
A method includes identifying deposition thickness property data associated with an amount of material deposited via one or more substrate processing operations of a process recipe performed in a processing chamber. The method further includes determining, based on the deposition thickness property data and a variable clean time relationship of the process recipe, cleaning operation parameters. The method further includes causing, based on the cleaning operation parameters, a cleaning operation in the processing chamber.
Claims20
A method comprising:
- identifying deposition thickness property data associated with an amount of material deposited via one or more semiconductor processing operations of a process recipe performed in a processing chamber;
- determining, based on the deposition thickness property data and a variable clean time relationship of the process recipe, cleaning operation parameters;
- and
- causing, based on the cleaning operation parameters, a cleaning operation in the processing chamber.
A non-transitory computer-readable storage medium storing instructions which, when executed, cause a processing device to perform operations comprising:
- identifying deposition thickness property data associated with an amount of material deposited via one or more substrate processing operations of a process recipe performed in a processing chamber;
- determining, based on the deposition thickness property data and a variable clean time relationship of the process recipe, cleaning operation parameters;
- and
- causing, based on the cleaning operation parameters, a cleaning operation in the processing chamber.
A system comprising:
- a memory;
- and
- a processing device coupled to the memory, the processing device to:
- identify deposition thickness property data associated with an amount of material deposited via one or more substrate processing operations of a process recipe performed in a processing chamber;
- determine, based on the deposition thickness property data and a variable clean time relationship of the process recipe, cleaning operation parameters;
- and
- cause, based on the cleaning operation parameters, a cleaning operation in the processing chamber.
Dependencies are inferred from the claim text.