Jig for being integrated with ingot
AssigneeDisco Corporation
InventorsNaoki OMIYA, Kazuki MORI
Life of this patent
Estimating the term…
Abstract
A jig for use in manufacturing a wafer from an ingot and for being delivered while being integrated with the ingot includes a base having a holding mechanism for holding the ingot such that the ingot protrudes therefrom and an information recording member fixed to the base for recording individual information of the ingot identifiably therein. Preferably, the base has a disk-shaped recess defined therein that has a predetermined depth for accommodating a bottom portion of the ingot therein.
Claims8
A jig for use in manufacturing a wafer from an ingot and for being delivered while being integrated with the ingot, comprising:
- a base having a holding mechanism for holding the ingot such that the ingot protrudes therefrom;
- and
- an information recording member fixed to the base for recording individual information of the ingot identifiably therein.
A method of manufacturing a plurality of wafers from each of a plurality of ingot units each including an ingot and a jig that are integrated with each other, the jig including a base having a holding mechanism for holding the ingot such that the ingot protrudes therefrom and an information recording member fixed to the base for recording individual information of the ingot identifiably therein, the method comprising:
- a peel-off layer forming step of delivering an ingot unit to a laser processing apparatus and processing the ingot of the ingot unit with a laser beam on the laser processing apparatus to form a peel-off layer at a predetermined depth in the ingot as peeling initiating points along which a wafer is to be peeled off from the ingot;
- a peeling step of delivering the ingot unit with the peel-off layer formed in the ingot to a peeling apparatus and peeling off the wafer from the ingot along the peel-off layer;
- and
- a grinding step of delivering the ingot unit from which the wafer has been peeled off to a grinding apparatus and grinding an upper surface of the ingot of the ingot unit on the grinding apparatus, wherein
- each of the ingot units is delivered successively to the laser processing apparatus, the peeling apparatus, and the grinding apparatus to circulate therethrough such that peel-off layer forming step, peeling step, and grinding step are successively performed on each of the ingot units, manufacturing a plurality of wafers from each of the respective ingots of the ingot units.
Dependencies are inferred from the claim text.