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US 2024/0223969 A1Published application
Roll-to-roll micro-scale thermal wire microphone
AssigneeNikon Corporation
InventorFardad Ali HASHEMI
Life of this patent
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Abstract
Micro-wire sensors comprise a conductive sensing element situated above a substrate. The sensing element can be fixed to the substrate at one or more ends and can be formed by patterning a conductive layer deposited on a flexible or other substrate. Conductive connecting pads and bias resistors can be formed with the sensing element in a common conductive layer.
Claims28
A sensor, comprising:
- a substrate;
- a sensing element secured to the substrate at least one end so that the sensing element is spaced apart from the substrate;
- and
- a sensor circuit coupled to the sensing element and operable to heat the sensing element and produce an output signal associated with vibrations of the sensing element.
1 more element
A method, comprising:
- forming a conductive layer coupled to a substrate;
- and
- patterning the conductive layer to define a conductive sensing element spaced apart from the substrate, wherein a first fixed end and a second fixed end of the conductive sensing element are secured to the substrate.
A sensor array, comprising:
- a substrate;
- a plurality of sensors defined on the substrate, each of the plurality of sensors including a sensing element;
- and
- at least one spacer coupled to the sensing element of each of the plurality of sensors and the substrate to define a gap between the sensing elements and the substrate.
1 more element
Dependencies are inferred from the claim text.