Integrated clean and dry module for cleaning a substrate

A cleaning and drying module comprising:

• a process rotor having a plurality of grip pins configured to releasably hold a substrate, the process rotor being configured to rotate and to move between a lowered position and a raised position;
• at least one sweep arm having a nozzle mechanism configured to apply a fluid to the substrate;
• a collection rotor configured to rotate synchronously with the process rotor and defining a processing volume between the process rotor and an interior of the collection rotor, the collection rotor comprising:
• a sidewall extending above the process rotor in the lowered position, an inner surface of the sidewall being angled inward from a lower portion to an upper portion,
• a collection weir defined by a bottom portion of the collection rotor and the inner surface, the collection weir being configured to collect the fluids applied to the substrate, and
• a plurality of drain holes positioned in the collection weir proximate the inner surface of the sidewall, the drain holes configured to drain the collected fluids and particles from the collection weir;
• a rotor cover surrounding and extending above the sidewall of the collection rotor defining an annular volume between the rotor cover and the collection rotor, the plurality of grip pins of the process rotor extending above the rotor cover when positioned in the raised position;
• an exhaust in communication with the drain holes, the exhaust configured to draw air from the processing volume and the annular volume through the drain holes and to receive the collected fluid;
• and
• an enclosure covering the process rotor, the collection rotor, the rotor cover and the sweep arms, the enclosure comprising:
• a first door on a first side of the enclosure, and
• a second door on a second side of the enclosure different from the first side.

A method for cleaning a substrate in a cleaning and drying module, the method comprising:

• placing the cleaning and drying module in a first substrate transfer position in which:
• a process rotor thereof is in a raised position,
• a plurality of grip pins on the process rotor are in a substrate release position,
• a first door on a first side of an enclosure is opened, and
• a second door on second side of the enclosure different from the first side is closed;
• receiving a substrate through the first door on a plurality of stand-off pins on the process rotor;
• placing the cleaning and drying module in a substrate cleaning and drying position in which:
• the process rotor is in a lowered position,
• the plurality of grip pins are in a substrate gripping position, and
• the first and second doors are closed;
• performing a cleaning process on the substrate comprising rotating the process rotor and the substrate gripped by the grip pins and applying a cleaning fluid to the substrate with a first nozzle mechanism mounted on a first sweep arm;
• performing a final rinse and dry process on the substrate comprising rotating the process rotor and the substrate gripped by the grip pins and applying at least one of a rinsing fluid and a drying fluid to the substrate with a second nozzle mechanism mounted on a second sweep arm;
• and
• placing the cleaning and drying module in a second substrate transfer position in which:
• the process rotor is in the raised position,
• the plurality of grip pins on the process rotor are in a substrate release position and the substrate is supported on the stand-off pins,
• the first door is closed, and
• the second door is opened;
• and
• allowing the substrate to be removed through the second door.