Electroplating gold plating solution and use thereof

Abstract

Embodiments of the present invention provide an electroplating gold plating solution and use thereof. The electroplating gold plating solution comprises a gold cyanide salt, a conductive salt, an oxalate, a lead-containing compound, and additives comprising a phenolic compound and/or gelatin. The general formula of the phenolic compound is as shown in the following formula (1): Wherein at least one of R1, R2, R3, R4, R5, and R6 is selected from hydroxyl, and the rest are each independently any one selected from the group consisting of hydrogen atom, halogen group, carboxyl, aldehyde, sulfonic acid group, amino, or alkyl. The technical solution of the present invention can produce the gold bump having a high hardness after heat treatment by adding a phenolic compound and/or gelatin in the electroplating gold plating solution, which is conducive to preventing the gold bump from deformation during the thermocompression bonding process.

Dependencies are inferred from the claim text.