Masking tape for forming electromagnetic wave shield
AssigneeNitto Denko Corporation
InventorYuji OKAWA
Life of this patent
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Abstract
Provided is a masking tape to be used at the time of formation of an electromagnetic wave shield, which is excellent in followability to irregularities, and which is capable of being peeled off from an irregular surface without any adhesive residue. The masking tape for forming an electromagnetic wave shield includes a pressure-sensitive adhesive layer that is increased in modulus of elasticity through active energy ray irradiation to 20 times or more as high as that before the active energy ray irradiation, wherein the pressure-sensitive adhesive layer has a modulus of elasticity after the active energy ray irradiation of 500 MPa or less.
Claims6
A method of forming an electromagnetic wave shield, comprising:
- preparing a masking tape;
- applying the masking tape to a surface of an electronic component on which an electromagnetic wave shield is not to be formed;
- and
- performing active energy ray irradiation of the masking tape applied to the surface of the electronic component,
- wherein the masking tape comprises a base material;
- a pressure-sensitive adhesive layer including an active energy ray-curable pressure-sensitive adhesive (A1) containing a base polymer, and an active energy ray-reactive monomer or oligomer capable of binding to the base polymer, or an active energy ray-curable pressure-sensitive adhesive (A2) containing an active energy ray-reactive polymer as a base polymer, and
- an intermediate layer arranged on one side of the pressure-sensitive adhesive layer and arranged between the base material and the pressure-sensitive adhesive layer,
- wherein a modulus of elasticity of the pressure-sensitive adhesive layer after active energy ray irradiation is at least 20 times or higher than a modulus of elasticity before the active energy ray irradiation,
- wherein the pressure-sensitive adhesive layer has a modulus of elasticity before active energy ray irradiation of from 0.07 MPa to 0.70 MPa,
- wherein the pressure-sensitive adhesive layer has a modulus of elasticity after the active energy ray irradiation of 500 MPa or less,
- wherein the intermediate layer has a modulus of elasticity before active energy ray irradiation of from 0.07 MPa to 0.70 MPa,
- wherein the modulus of elasticity of the intermediate layer is lower than the modulus of elasticity of the pressure-sensitive adhesive layer after the active energy ray irradiation, and
- wherein the active energy ray irradiation is performed by irradiation with ultraviolet rays at a cumulative light amount of from 500 mJ/cm2 to 4,000 mJ/cm2.
Dependencies are inferred from the claim text.