Ultrathin laminated glass and glass stiffeners for coreless packages

A package substrate, comprising:

• a plurality of first buildup layers in a stack;
• a stiffener around a perimeter of the plurality of first buildup layers;
• and
• a second buildup layer over the plurality of first buildup layers and the stiffener, and wherein the second buildup layer fills a gap between an inner surface of the stiffener and an outer surface of the plurality of first buildup layers.

A computing system, comprising:

• a board;
• a package substrate coupled to the board, wherein the package substrate comprises:
• a glass reinforcement layer;
• and
• a plurality of buildup layers with electrically conductive routing;
• and
• a die coupled to the package substrate.