Processing apparatus
AssigneeEbara Corporation
InventorsToshio MIZUNO, Yosuke HIMORI
Life of this patent
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Abstract
Provided is a technique allowing an effective process of a bevel portion of a workpiece. A processing apparatus 1 includes a workpiece table 10 configured to hold a workpiece Wf, and a processing head 30 configured to hold a processing pad Pd. The processing pad includes a pad surface 120 provided with at least one groove 130 having an inner circumferential groove wall 131 and an outer circumferential groove wall 132. The processing apparatus 1 is configured to rotate the workpiece table and the processing head, and bring an edge 133 of the inner circumferential groove wall and an edge 134 of the outer circumferential groove wall in contact with a bevel portion 100 of the workpiece during a process of the workpiece.
Claims11
A processing apparatus comprising:
- a workpiece table configured to hold a workpiece;
- and
- a processing head configured to hold a processing pad, wherein
- the processing pad includes a pad surface provided with at least one groove having an inner circumferential groove wall and an outer circumferential groove wall disposed in an outer circumferential side with respect to the inner circumferential groove wall, and
- the processing apparatus is configured to rotate the workpiece table and the processing head, and bring an edge of the inner circumferential groove wall and an edge of the outer circumferential groove wall in contact with a bevel portion provided at an outer circumferential edge of the workpiece during a process of the workpiece.
Dependencies are inferred from the claim text.