Printed circuit board and manufacturing method thereof
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsMi Jeong JEON, Hyun Seok YANG, Tae Hee YOO, Chan Jin PARK
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Abstract
A printed circuit board includes a first insulating layer, a first metal layer disposed on the first insulating layer and including a first oxidation region on a side surface thereof, and a second metal layer disposed on the first metal layer. A method of manufacturing a printed circuit board includes forming a first metal layer on a first insulating layer, forming a second metal layer on a portion of the first metal layer, oxidizing another portion of the first metal layer to form a first oxidation region, and removing at least a portion of the first oxidation region.
Claims23
A printed circuit board comprising:
- a first insulating layer;
- a first metal layer disposed on the first insulating layer and including a first oxidation region on a side surface thereof;
- and
- a second metal layer disposed on the first metal layer.
A method of manufacturing a printed circuit board, the method comprising:
- forming a first metal layer on a first insulating layer;
- forming a second metal layer on a portion of the first metal layer;
- oxidizing another portion of the first metal layer to form a first oxidation region;
- and
- removing at least a portion of the first oxidation region.
A printed circuit board comprising:
- a first insulating layer;
- a first metal layer;
- a second metal layer having a thickness greater than the first metal layer and disposed on the first metal layer;
- and
- a second insulating layer disposed on the first insulating layer to cover side surfaces of the first metal layer and the second metal layer,
- wherein the first metal layer includes an end portion having a composition different from a center portion and being in contact with the second insulating layer.
Dependencies are inferred from the claim text.