Method of fully encapsulating electronics within a strap

Abstract

Herein disclosed is a method of manufacturing a strap comprising providing a mould for a strap, the strap comprising a first opening and a second opening, providing a printed circuit board (PCB), comprising at least one electronic component, applying a membrane to said electronic component, attaching a chassis to said PCB at said electronic component such that said membrane is sealed against said electronic component; injecting a wet applied structural component into said mould.

Dependencies are inferred from the claim text.