Deposition device and deposition method
AssigneeJapan Display Inc.
InventorsTakanobu TAKENAKA, Atsushi TAKEDA
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Abstract
According to one embodiment, a deposition method includes preparing a processing substrate in which a lower electrode, a rib, and a partition including a lower portion and an upper portion arranged on the lower portion and protruding from a side surface of the lower portion are formed above a substrate, setting a spread angle of vapor of a first material emitted from a first deposition head to a first angle, and depositing the first material on the processing substrate, and setting a spread angle of vapor of a second material emitted from a second deposition head to a second angle larger than the first angle, and depositing the second material on the processing substrate on which the first material is deposited.
Claims8
A deposition device comprising:
- a first stage;
- a first deposition head configured to deposit a first material on a processing substrate arranged on the first stage;
- a second stage;
- and
- a second deposition head configured to deposit a second material on the processing substrate which is arranged on the second stage and on which the first material is deposited,
- each of the first deposition head and the second deposition head comprising:
- a deposition source heating a material and generating vapor;
- and
- a nozzle connected to the deposition source to emit the vapor generated by the deposition source,
- a spread angle of the vapor of the first material emitted from the first deposition head being set to a first angle,
- a spread angle of the vapor of the second material emitted from the second deposition head being set to a second angle different from the first angle.
Dependencies are inferred from the claim text.