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US 2024/0206601 A1Published application
Method of fully encapsulating electronics within a strap
OwnerPatrick James FAWCETT, Richard DINANinventors
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Abstract
Herein disclosed is a method of manufacturing a strap comprising providing a mould for a strap, the strap comprising a first opening and a second opening, providing a printed circuit board (PCB), comprising at least one electronic component, applying a membrane to said electronic component, attaching a chassis to said PCB at said electronic component such that said membrane is sealed against said electronic component; injecting a wet applied structural component into said mould.
Claims8
A strap for a wearable device, comprising:
- a printed circuit board (PCB) on which is mounted electronic components including a transmitter for transmitting radio signals and a button in electrical communication with said transmitter,
- a chassis attached to said button,
- a depressible button interface mounted on said chassis,
- a membrane providing a waterproof seal for said button,
- wherein when said depressible button interface is pressed, said waterproof seal deforms and actuates said button.
2 more elements
Dependencies are inferred from the claim text.