# US 2024/0203902 A1 · Module

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- Number: US 2024/0203902 A1
- Document ID: US20240203902A1
- Status: Published application
- Kind: A1
- Application number: 18/588,564
- Filed: 2024-02-27
- Published: 2024-06-20
- Earliest claimed: 2021-09-30
- Assignees: Murata Manufacturing Co., Ltd.
- Applicants: Murata Manufacturing Co., Ltd.
- Inventors: Yoshihito OTSUBO; Tsuyoshi TAKAKURA
- Web page: https://patentgrep.com/patent/US20240203902A1

## CPC

- H10W 42/20: protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
- H10W 72/50: Bond wires
- H10W 74/114: {by a substrate and the encapsulations}
- H10W 90/00: Package configurations
- H10W 99/00: Subject matter not provided for in other groups of this subclass
- H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A module includes: one or more electronic components and one or more pad electrodes disposed and aligned such that lower ends thereof are positioned on a reference surface; and a sealing resin disposed to seal the one or more pad electrodes and the one or more electronic components. A first surface serving as an upper surface and a second surface serving as a side surface of the sealing resin are covered with a shield film. A first wire and a second wire are disposed in the sealing resin to electrically connect the one or more pad electrodes and the shield film at a first point and a second point, respectively, that are selected from the first surface and the second surface. The first point and the second point are different in height when viewed from the reference surface.

## Claims

### Claim 1

A module comprising:
one or more electronic components disposed and aligned such that lower ends thereof are positioned on a reference surface;
one or more pad electrodes disposed such that lower ends thereof are positioned on the reference surface; and
a sealing resin disposed to seal the one or more pad electrodes and the one or more electronic components from above, wherein
the sealing resin has a first surface serving as an upper surface and a second surface serving as a side surface,
the first surface and the second surface are covered with a shield film,
a first wire is disposed in the sealing resin to electrically connect the one or more pad electrodes and the shield film at a first point selected from the first surface and the second surface,
a second wire is disposed in the sealing resin to electrically connect the one or more pad electrodes and the shield film at a second point selected from the first surface and the second surface, and
the first point and the second point are different in height when viewed from the reference surface.

### Claim 2 (depends on 1)

The module according to claim 1, wherein
the one or more pad electrodes are connected to the shield film at a boundary between the second surface and the reference surface.

### Claim 3 (depends on 1)

The module according to claim 1, wherein
the one or more electronic components include a first electronic component and a second electronic component,
a plurality of wires are connected to a first pad electrode being one of the one or more pad electrodes,
the plurality of wires are connected to the shield film on the first surface, and
the plurality of wires are disposed to separate the first electronic component and the second electronic component.

### Claim 4 (depends on 1)

The module according to claim 1, wherein
the first wire and the second wire are both connected to a second pad electrode being one of the one or more pad electrodes, and
a part of the second pad electrode extends and is connected to the shield film at a boundary between the second surface and the reference surface.

### Claim 5 (depends on 1)

The module according to claim 1, wherein
the reference surface is a lower surface of the module.

### Claim 6 (depends on 1)

The module according to claim 1, wherein
the module includes a substrate, and
the reference surface is a surface of the substrate facing the sealing resin.

### Claim 7 (depends on 2)

The module according to claim 2, wherein
the reference surface is a lower surface of the module.

### Claim 8 (depends on 3)

The module according to claim 3, wherein
the reference surface is a lower surface of the module.

### Claim 9 (depends on 4)

The module according to claim 4, wherein
the reference surface is a lower surface of the module.

### Claim 10 (depends on 2)

The module according to claim 2, wherein
the module includes a substrate, and
the reference surface is a surface of the substrate facing the sealing resin.

### Claim 11 (depends on 3)

The module according to claim 3, wherein
the module includes a substrate, and
the reference surface is a surface of the substrate facing the sealing resin.

### Claim 12 (depends on 4)

The module according to claim 4, wherein
the module includes a substrate, and
the reference surface is a surface of the substrate facing the scaling resin.