# US 2024/0203809 A1 · Electronic device including rigid dielectric lid and overlaying thermoset polymer layer and related methods > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2024/0203809 A1 - Document ID: US20240203809A1 - Status: Published application - Kind: A1 - Application number: 18/085,173 - Filed: 2022-12-20 - Published: 2024-06-20 - Earliest claimed: 2022-12-20 - Assignees: Eagle Technology, LLC - Applicants: Eagle Technology. LLC - Inventors: Louis R. PARADISO; Douglas R. HEILMAN - Web page: https://patentgrep.com/patent/US20240203809A1 ## CPC - H10W 74/114: {by a substrate and the encapsulations} - H10W 72/071: {Connecting or disconnecting} - H10W 72/075: {of bond wires} - H10W 72/50: Bond wires - H10W 74/01: Manufacture or treatment - H10W 76/12: characterised by their shape - H10W 76/15: Containers comprising an insulating or insulated base - H10W 76/43: Gaseous fillings - H10W 72/07554: {changes in dispositions} - H10W 74/00: Encapsulations, e.g. protective coatings - H10W 74/10: characterised by their shape or disposition - H10W 74/40: characterised by their materials - H10W 74/47: comprising organic materials, e.g. plastics or resins - H10W 76/18: Insulating materials, e.g. resins, glasses or ceramics - H10W 76/60: Seals - H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract An electronic device may include a dielectric substrate and bond wire pads on an upper surface thereof. The electronic device may also include a radio frequency (RF) integrated circuit (IC) mounted to the upper surface of the dielectric substrate and bond wires coupling the RF IC to respective bond wire pads. The electronic device may also include a rigid dielectric lid mounted to the upper surface of the dielectric substrate to define an air cavity above the RF IC and the bond wires, and a thermosetting polymer layer over the rigid dielectric lid. ## Claims ### Claim 1 An electronic device comprising: a dielectric substrate and a plurality of bond wire pads on an upper surface thereof; a radio frequency (RF) integrated circuit (IC) mounted to the upper surface of the dielectric substrate; a plurality of bond wires coupling the RF IC to respective bond wire pads; a rigid dielectric lid mounted to the upper surface of the dielectric substrate to define an air cavity above the RF IC and the plurality of bond wires; and a thermoset polymer layer over the rigid dielectric lid. ### Claim 2 (depends on 1) The electronic device of claim 1 wherein the RF IC comprises a Monolithic Microwave Integrated Circuit (MMIC). ### Claim 3 (depends on 1) The electronic device of claim 1 wherein the rigid dielectric lid has a melting temperature above a curing temperature of the thermoset polymer layer. ### Claim 4 (depends on 1) The electronic device of claim 1 wherein the rigid dielectric lid comprises a top and a plurality of sidewalls depending therefrom. ### Claim 5 (depends on 1) The electronic device of claim 1 wherein the plurality of bond wire pads are spaced inwardly from a perimeter of the dielectric substrate and outwardly from the RF IC. ### Claim 6 (depends on 1) The electronic device of claim 1 wherein the thermoset polymer layer has a conformal shape with the rigid dielectric lid. ### Claim 7 (depends on 1) The electronic device of claim 1 wherein the thermoset polymer layer and the rigid dielectric lid define a near hermetic seal with the dielectric substrate. ### Claim 8 (depends on 1) The electronic device of claim 1 further comprising an adhesive securing the rigid dielectric lid to the upper surface of the dielectric substrate. ### Claim 9 An electronic device comprising: a dielectric substrate and a plurality of bond wire pads on an upper surface thereof; a Monolithic Microwave Integrated Circuit (MMIC) mounted to the upper surface of the dielectric substrate; a plurality of bond wires coupling the MMIC to respective bond wire pads; a rigid dielectric lid mounted to the upper surface of the dielectric substrate to define an air cavity above the RF IC and the plurality of bond wires; an adhesive securing the rigid dielectric lid to the upper surface of the dielectric substrate; and a thermoset polymer layer over the rigid dielectric lid. ### Claim 10 (depends on 9) The electronic device of claim 9 wherein the rigid dielectric lid has a melting temperature above a curing temperature of the thermoset polymer layer. ### Claim 11 (depends on 9) The electronic device of claim 9 wherein the rigid dielectric lid comprises a top and a plurality of sidewalls depending therefrom. ### Claim 12 (depends on 9) The electronic device of claim 9 wherein the plurality of bond wire pads are spaced inwardly from a perimeter of the dielectric substrate and outwardly from the MMIC. ### Claim 13 (depends on 9) The electronic device of claim 9 wherein the thermoset polymer layer has a conformal shape with the rigid dielectric lid. ### Claim 14 (depends on 9) The electronic device of claim 9 wherein the thermoset polymer layer and the rigid dielectric lid define a near hermetic seal with the dielectric substrate. ### Claim 15 A method for making an electronic device comprising: mounting a radio frequency (RF) integrated circuit (IC) to an upper surface of a dielectric substrate having a plurality of bond wire pads on the upper surface thereof; coupling a plurality of bond wires between the RF IC and respective bond wire pads; mounting a rigid dielectric lid to the upper surface of the dielectric substrate to define an air cavity above the RF IC and the plurality of bond wires; and curing a thermoset polymer layer over the rigid dielectric lid. ### Claim 16 (depends on 15) The method of claim 15 wherein the RF IC comprises a Monolithic Microwave Integrated Circuit (MMIC). ### Claim 17 (depends on 15) The method of claim 15 wherein the rigid dielectric lid has a melting temperature above a curing temperature of the thermoset polymer layer. ### Claim 18 (depends on 15) The method of claim 15 wherein the rigid dielectric lid comprises a top and a plurality of sidewalls depending therefrom. ### Claim 19 (depends on 15) The method of claim 15 wherein the plurality of bond wire pads are spaced inwardly from a perimeter of the dielectric substrate and outwardly from the RF IC. ### Claim 20 (depends on 15) The method of claim 15 wherein the thermoset polymer layer and the rigid dielectric lid define a near hermetic seal with the dielectric substrate.