# US 2024/0202484 A1 · Smart card with metal inlay encapsulating high-density metal plug > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2024/0202484 A1 - Document ID: US20240202484A1 - Status: Published application - Kind: A1 - Application number: 18/084,039 - Filed: 2022-12-19 - Published: 2024-06-20 - Earliest claimed: 2022-12-19 - Assignees: Idemia America Corp. - Applicants: Idemia America Corp. - Inventors: Scott DONNELLY; Michael REED - Web page: https://patentgrep.com/patent/US20240202484A1 ## CPC - G06K 19/02: characterised by the selection of materials, e.g. to avoid wear during transport through the machine - G06K 19/07722: {the record carrier being multilayered, e.g. laminated sheets (flat articles in general, see B32B37/00)} - G06K 19/07747: {at least one of the integrated circuit chips being mounted as a module} - G06K 19/07769: {the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface} - G06K: GRAPHICAL DATA READING (image or video recognition or understanding G06V); PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS ## Abstract A metal smart card, having an inlay layer, the inlay layer including a metal card body, the metal card body defining at least one cavity in the metal card body, the at least one cavity having a continuous surface defined by an inner surface of the metal card body, a metal plug, the metal plug being housed inside the at least one cavity, an electronic component, the electronic component being housed inside the at least one cavity, and a polymer layer disposed on an outer surface of the inlay layer, the polymer layer being in contact with an outer surface of the metal plug. ## Claims ### Claim 1 An inlay layer of a metal smart card, comprising: a metal card body, the metal card body defining at least one cavity, the at least one cavity having a continuous surface defined by an inner surface of the metal card body; a metal plug, the metal plug being housed inside the at least one cavity; and an electronic component, the electronic component being housed inside the at least one cavity. ### Claim 2 (depends on 1) The inlay layer of claim 1, wherein the metal card body is composed of a first metal, and wherein the metal plug is composed of a second metal. ### Claim 3 (depends on 2) The inlay layer of claim 2, wherein a density of the second metal is greater than a density of the first metal. ### Claim 4 (depends on 1) The inlay layer of claim 1, wherein the continuous surface of the at least one cavity is discontinuous with an edge of the metal card body. ### Claim 5 (depends on 1) The inlay layer of claim 1, wherein the metal plug defines a cavity in the metal plug, the cavity having a continuous surface defined by an inner surface of the metal plug. ### Claim 6 (depends on 5) The inlay layer of claim 5, wherein the electronic component is fully or partially encapsulated by the cavity in the metal plug. ### Claim 7 (depends on 5) The inlay layer of claim 5, wherein the cavity in the metal plug extends through the top and bottom outer surfaces of the metal plug. ### Claim 8 (depends on 1) The inlay layer of claim 1, wherein the at least one cavity in the metal card body is a first cavity and a second cavity, wherein the continuous surface of the first cavity is discontinuous with the continuous surface of the second cavity, and wherein the metal plug is housed inside the first cavity and the electronic component is housed inside the second cavity. ### Claim 9 A metal smart card, comprising: an inlay layer, the inlay layer comprising: a metal card body, the metal card body defining at least one cavity in the metal card body, the at least one cavity having a continuous surface defined by an inner surface of the metal card body; a metal plug, the heavy metal plug being housed inside the at least one cavity; and an electronic component, the electronic component being housed inside the at least one cavity; and a polymer layer disposed on an outer surface of the inlay layer, wherein the polymer layer is in contact with an outer surface of the metal plug. ### Claim 10 (depends on 9) The metal smart card of claim 9, wherein the metal card body is composed of a first metal and the metal plug is composed of a second metal. ### Claim 11 (depends on 10) The metal smart card of claim 10, wherein a density of the second metal is greater than a density of the first metal. ### Claim 12 (depends on 9) The inlay layer of claim 9, wherein the continuous surface of the at least one cavity is discontinuous with an edge of the metal card body. ### Claim 13 (depends on 9) The metal smart card of claim 9, wherein the metal plug defines a cavity in the metal plug, the cavity having a continuous surface defined by an inner surface of the metal plug. ### Claim 14 (depends on 13) The metal smart card of claim 13, wherein the electronic component is fully or partially encapsulated by the cavity in the metal plug. ### Claim 15 (depends on 13) The metal smart card of claim 13, wherein the cavity in the metal plug extends through the top and bottom surfaces of the metal plug. ### Claim 16 (depends on 9) The metal smart card of claim 9, wherein the at least one cavity in the metal card body is a first cavity and a second cavity, wherein the continuous surface of the first cavity is discontinuous with the continuous surface of the second cavity, and wherein the metal plug is housed in the first cavity and the electronic component is housed in the second cavity. ### Claim 17 A method for manufacturing a metal smart card inlay, the method comprising: forming a metal card body of a first metal; forming at least one cavity in the metal card body, the at least one cavity having a continuous surface defined by an inner surface of the metal card body; forming a metal plug of a second metal; depositing the metal plug in the at least one cavity in the metal card body; and depositing an electronic component in the at least one cavity in the metal card body. ### Claim 18 (depends on 17) The method of claim 17, wherein a density of the second metal is greater than a density of the first metal. ### Claim 19 (depends on 17) The method of claim 17, further comprising forming a cavity in the metal plug, the cavity having a continuous surface defined by an inner surface of the metal plug, wherein the electronic component is partially or fully housed in the cavity in the metal plug. ### Claim 20 (depends on 17) The method of claim 17, wherein the at least one cavity is a first cavity and a second cavity, wherein the continuous surface of the first cavity is discontinuous with the continuous surface of the second cavity, and wherein the metal plug is deposited in the first cavity and the electronic component is deposited in the second cavity.