# US 2024/0201459 A1 · RoF COMMUNICATION DEVICE WITH INTEGRATION OF RF CIRCUIT BOARD AND OPTICAL MODULE

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- Number: US 2024/0201459 A1
- Document ID: US20240201459A1
- Status: Published application
- Kind: A1
- Application number: 18/179,788
- Filed: 2023-03-07
- Published: 2024-06-20
- Earliest claimed: 2022-12-20
- Assignees: Global Technology Inc.
- Applicants: Global Technology Inc.
- Inventors: Na ZHANG; Fan YANG; Qikun HUANG
- Web page: https://patentgrep.com/patent/US20240201459A1

## CPC

- G02B 6/428: {containing printed circuit boards [PCB]}
- G02B 6/4246: {Bidirectionally operating package structures}
- G02B 6/4251: {Sealed packages (G02B6/4248 takes precedence)}
- G02B 6/4271: {with thermo electric cooling}
- H04B 10/2575: Radio-over-fibre, e.g. radio frequency signal modulated onto an optical carrier
- G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- H04B: TRANSMISSION

## Abstract

A RoF communication device includes a RF circuit board and an optical module. The optical module includes a casing, a connection circuit board, an optical transmitting unit and an optical receiving unit. The casing is connected with the RF circuit board. The connection circuit board is accommodated in the casing. The optical transmitting unit is mounted on the connection circuit board. The optical receiving unit is mounted on the connection circuit board. The electrical interface of the RF circuit board is provided in the casing, and the optical transmitting unit and the optical receiving unit are electrically connected with the electrical interface.

## Claims

### Claim 1

A radio over fiber (RoF) communication device, comprising:
a radio frequency (RF) circuit board; and
an optical module, comprising:
a casing, connected with the RF circuit board;
a connection circuit board, accommodated in the casing;
an optical transmitting unit, mounted on the connection circuit board; and
an optical receiving unit, mounted on the connection circuit board;
wherein an electrical interface of the RF circuit board is provided in the casing, and the optical transmitting unit and the optical receiving unit are electrically connected with the electrical interface.

### Claim 2 (depends on 1)

The RoF communication device according to claim 1, wherein the optical transmitting unit and the optical receiving unit are mounted on a top surface and a bottom surface of the connection circuit board, respectively.

### Claim 3 (depends on 1)

The RoF communication device according to claim 1, wherein the RF circuit board is a rigid circuit board.

### Claim 4 (depends on 1)

The RoF communication device according to claim 1, wherein the optical transmitting unit and the optical receiving unit are electrically connected with the electrical interface by wire bonding.

### Claim 5 (depends on 1)

The RoF communication device according to claim 1, wherein a distance between the optical transmitting unit and the electrical interface is different from a distance between the optical receiving unit and the electrical interface in a thickness direction of the RF circuit board.

### Claim 6 (depends on 5)

The RoF communication device according to claim 5, wherein the distance between the optical transmitting unit and the electrical interface is smaller than the distance between the optical receiving unit and the electrical interface in the thickness direction of the RF circuit board.

### Claim 7 (depends on 1)

The RoF communication device according to claim 1, wherein the optical module further comprises a thermoelectric cooler, and the connection circuit board is mounted on the thermoelectric cooler.

### Claim 8 (depends on 1)

The RoF communication device according to claim 1, wherein the casing is an airtight casing.