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US 2024/0200262 A1Published application
Cut surface smoothing device and manufacturing system
Assigneeairweave inc.
InventorAkira MIZUNO
Life of this patent
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Abstract
A cut surface smoothing device which can smooth the cut surface of a filament three-dimensional bonded member is provided. The cut surface smoothing device includes a high temperature portion which is heated to a temperature equal to or higher than the melting point of the filament three-dimensional bonded member, and the high temperature portion is applied to the cut surface of the filament three-dimensional bonded member to smooth the cut surface.
Claims13
A cut surface smoothing device comprising:
- a high temperature portion that is heated to a temperature equal to or higher than a melting point of a filament three-dimensional bonded member,
- wherein the high temperature portion is applied to a cut surface of the filament three-dimensional bonded member to smooth the cut surface,
- the cut surface of the filament three-dimensional bonded member that is conveyed parallel to the cut surface is smoothed, and
- the high temperature portion is arranged to rotate in a same direction as the conveyance while being applied to the cut surface.
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A cut surface smoothing device comprising:
- a high temperature portion that is heated to a temperature equal to or higher than a melting point of a filament three-dimensional bonded member,
- wherein the high temperature portion is applied to a cut surface of the filament three-dimensional bonded member to smooth the cut surface,
- the cut surface smoothing device includes:
- the high temperature portion that is a wall surface;
- and
- a fixing vibration table that exposes the cut surface and fixes and supports the filament three-dimensional bonded member,
- wherein the fixing vibration table vibrates parallel to the cut surface while applying the cut surface to the wall surface to smooth the cut surface.
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Dependencies are inferred from the claim text.