# US 2024/0199902 A1 · Curable composition and cured product thereof > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2024/0199902 A1 - Document ID: US20240199902A1 - Status: Published application - Kind: A1 - Application number: 18/551,054 - Filed: 2022-03-03 - Published: 2024-06-20 - Earliest claimed: 2021-03-19 - Assignees: Taiyo Holdings Co., Ltd. - Applicants: TAIYO Holding Co., Ltd. - Inventors: Yutaka YOKOYAMA; Kazuyoshi YONEDA - Web page: https://patentgrep.com/patent/US20240199902A1 ## CPC - C08F 2/50: with sensitising agents - C09D 11/38: characterised by non-macromolecular additives other than solvents, pigments or dyes - C08F 2/44: Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers - C08F 2/48: by ultraviolet or visible light - C09D 11/101: Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing - C09D 11/107: from unsaturated acids or derivatives thereof - C09D 133/066: {containing -OH groups} - C09D 135/02: Homopolymers or copolymers of esters (C09D135/06, C09D135/08 take precedence) - C08K 5/523: with hydroxyaryl compounds - C08K 5/5399: Phosphorus bound to nitrogen - C09J 4/00: Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond {; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16} - C08F: MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS - C09D: COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR (cosmetics A61K; processes for applying liquids or other fluent materials to surfaces, in general, B05D; staining wood B27K5/02; glazes or vitreous enamels C03C; natural resins, French polish, drying-oils, driers, turpentine, per se, C09F; polishing compositions other than French polish, ski waxes C09G; adhesives or use of materials as adhesives C09J; materials for sealing or packing joints or covers C09K3/10; materials for stopping leaks C09K3/12; processes for the electrolytic or electrophoretic production of coatings C25D) - C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09) - C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H) ## Abstract [Objective] To provide a curable composition that is useful as, for example, a solder resist for printed wiring boards, is higher in flame retardancy, coatability, resolution, storage stability and low warpage and is also suitable for an inkjet printing method, and a cured product thereof. [Solution] A curable composition containing (A) a compound having a (meth)acryloyl group, (B) a heat-curable component, (C) a photopolymerization initiator, (D) a crystalline flame retardant and (E) a wetting and dispersing additive, in which the content of the wetting and dispersing additive (E) is 1% by weight to 9% by weight with respect to the content of the crystalline flame retardant (D), a cured product obtained from the curable composition and an electronic component having the cured product. ## Claims ### Claim at position 1 1: A curable composition, comprising: a compound having a (meth)acryloyl group; a heat-curable component; a photopolymerization initiator; a crystalline flame retardant; and a wetting and dispersing additive, wherein a content of the wetting and dispersing additive is in a range of 1% by weight to 9% by weight with respect to a content of the crystalline flame retardant. ### Claim at position 2 (depends on 1) 2: The curable composition according to claim 1, wherein the wetting and dispersing additive is a phosphorus-based wetting and dispersing additive. ### Claim at position 3 (depends on 1) 3: The curable composition according to claim 1, wherein the crystalline flame retardant includes a phosphorus-based crystalline flame retardant, and a content proportion of phosphorus derived from the phosphorus-based crystalline flame retardant in the curable composition is in a range of 1% by weight to 10% by weight. ### Claim at position 4 (depends on 1) 4: The curable composition according to claim 1, wherein the curable composition has a viscosity of 50 mPa·s or lower at 50° C. ### Claim at position 5 (depends on 1) 5: A cured product obtained by a process comprising curing the curable composition of claim 1. ### Claim at position 6 (depends on 5) 6: An electronic component, comprising: the cured product of claim 5. ### Claim at position 7 (depends on 2) 7: The curable composition according to claim 2, wherein the crystalline flame retardant includes a phosphorus-based crystalline flame retardant, and a content proportion of phosphorus derived from the phosphorus-based crystalline flame retardant in the curable composition is in a range of 1% by weight to 10% by weight. ### Claim at position 8 (depends on 2) 8: The curable composition according to claim 2, wherein the curable composition has a viscosity of 50 mPa·s or lower at 50° C. ### Claim at position 9 (depends on 2) 9: A cured product obtained by a process comprising curing the curable composition of claim 2. ### Claim at position 10 (depends on 9) 10: An electronic component, comprising: the cured product of claim 9. ### Claim at position 11 (depends on 3) 11: The curable composition according to claim 3, wherein the curable composition has a viscosity of 50 mPa·s or lower at 50° C. ### Claim at position 12 (depends on 3) 12: A cured product obtained by a process comprising curing the curable composition of claim 3. ### Claim at position 13 (depends on 12) 13: An electronic component, comprising: the cured product of claim 12. ### Claim at position 14 (depends on 4) 14: A cured product obtained by a process comprising curing the curable composition of claim 4. ### Claim at position 15 (depends on 14) 15: An electronic component, comprising: the cured product of claim 14. ### Claim at position 16 (depends on 7) 16: The curable composition according to claim 7, wherein the curable composition has a viscosity of 50 mPa·s or lower at 50° C. ### Claim at position 17 (depends on 7) 17: A cured product obtained by a process comprising curing the curable composition of claim 7. ### Claim at position 18 (depends on 17) 18: An electronic component, comprising: the cured product of claim 17. ### Claim at position 19 (depends on 16) 19: A cured product obtained by a process comprising curing the curable composition of claim 16. ### Claim at position 20 (depends on 19) 20: An electronic component, comprising: the cured product of claim 19.