# US 2024/0198677 A1 · Liquid ejection head and method of manufacturing the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2024/0198677 A1 - Document ID: US20240198677A1 - Status: Published application - Kind: A1 - Application number: 18/530,919 - Filed: 2023-12-06 - Published: 2024-06-20 - Earliest claimed: 2022-12-16 - Assignees: Canon Kabushiki Kaisha - Applicants: Canon Kabushiki Kaisha - Inventors: SHUHEI OYA; TOMOAKI KAMAGATA - Web page: https://patentgrep.com/patent/US20240198677A1 ## CPC - B41J 2/14072: {Electrical connections, e.g. details on electrodes, connecting the chip to the outside...} - B41J 2/1623: {bonding and adhesion} - B41J 2/14: Structure thereof {only for on-demand ink jet heads} - B41J 2/1603: {of the front shooter type} - B41J 2002/14362: {Assembling elements of heads} - B41J 2002/14491: {Electrical connection} - B41J: TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS ## Abstract A liquid ejection head includes an element substrate for ejecting liquid, a support member to which the element substrate is fixed, an electric wiring board arranged onto the support member and electrically connected to the element substrate by an electric connection portion, a sealant sealing the electric connection portion, and a cover member. The cover member is fixed onto the support member, and disposed to avoid the electric connection portion and the element substrate. In a direction parallel with a surface of the element substrate, the cover member includes a part facing an outer periphery of the element substrate, and, of the part, a distance to the outer periphery of the element substrate at a first surface of the cover member bonded with the support member is greater than a distance to the outer periphery of the element substrate at a second surface that is opposite to the first surface. ## Claims ### Claim 1 A liquid ejection head comprising: an element substrate including an energy generation element for ejecting liquid; a support member to which the element substrate is fixed; an electric wiring board arranged onto the support member and electrically connected to the element substrate by an electric connection portion; a sealant sealing the electric connection portion between the element substrate and the electric wiring board; and a cover member fixed onto the support member, and disposed to avoid the electric connection portion and the element substrate when viewed from a direction perpendicular to a surface of the element substrate, wherein, in a direction parallel with the surface of the element substrate, the cover member includes a part facing an outer periphery of the element substrate, and, of the part, a distance to the outer periphery of the element substrate at a first surface of the cover member bonded with the support member is greater than a distance to the outer periphery of the element substrate at a second surface that is opposite to the first surface. ### Claim 2 (depends on 1) The liquid ejection head according to claim 1, wherein the element substrate includes a first terminal electrically connected to the energy generation element, the electric wiring board includes a second terminal located side by side with the first terminal, and the electric connection portion includes the first terminal, the second terminal, and a connecting member that electrically connects the first terminal and the second terminal. ### Claim 3 (depends on 1) The liquid ejection head according to claim 1, wherein the cover member is disposed on the support member to overlap a part of the electric wiring board when viewed from the direction perpendicular to the surface of the element substrate. ### Claim 4 (depends on 1) The liquid ejection head according to claim 1, wherein the part facing the outer periphery of the element substrate in the cover member includes a surface connected to the opposite surface and extending in a thickness direction. ### Claim 5 (depends on 1) The liquid ejection head according to claim 1, wherein the support member includes a flow path for supplying liquid to the element substrate. ### Claim 6 (depends on 1) The liquid ejection head according to claim 1, wherein the cover member includes an opening portion, and the element substrate is disposed inside the opening portion, and wherein the part facing the outer periphery of the element substrate in the cover member is an inner peripheral portion of the opening portion. ### Claim 7 (depends on 1) The liquid ejection head according to claim 1, wherein the part facing the outer periphery of the element substrate in the cover member includes an inclined surface or a curved surface on which a distance to the outer periphery of the element substrate continuously changes. ### Claim 8 (depends on 1) The liquid ejection head according to claim 1, wherein the part facing the outer periphery of the element substrate in the cover member includes a protrusion portion protruding to the element substrate side, and the protrusion portion includes the opposite surface. ### Claim 9 (depends on 1) The liquid ejection head according to claim 1, wherein the cover member is formed of ceramic. ### Claim 10 (depends on 1) The liquid ejection head according to claim 1, wherein the cover member is formed of alumina. ### Claim 11 (depends on 1) The liquid ejection head according to claim 1, wherein the cover member is fixed to the support member by an adhesive, and the adhesive extends toward the element substrate side, farther than an end portion on a side near the outer periphery of the element substrate at the bonding surface of the cover member with the support member. ### Claim 12 (depends on 7) The liquid ejection head according to claim 7, wherein the support member and the cover member are each made of a hydrophilic material, and the adhesive is made of a water-repellent material. ### Claim 13 (depends on 8) The liquid ejection head according to claim 8, wherein a pure water contact angle on the first surface of the cover member is 40 degrees or less. ### Claim 14 A method of manufacturing a liquid ejection head, the method comprising: arranging an element substrate including an energy generation element for ejecting liquid and an electric wiring board onto a support member; electrically connecting the element substrate and the electric wiring board by an electric connection portion; disposing a cover member on the support member, to avoid the electric connection portion and the element substrate when viewed from a direction perpendicular to a surface of the element substrate; and sealing the electric connection portion between the element substrate and the electric wiring board by a sealant, wherein the cover member includes a part facing an outer periphery of the element substrate, and, of this part, a distance to the outer periphery of the element substrate at a first surface of the cover member bonded with the support member is greater than a distance to the outer periphery of the element substrate at a second surface that is opposite to the first surface, and wherein sealing the electric connection portion by the sealant includes enabling the sealant to move toward the element substrate along the cover member. ### Claim 15 (depends on 14) The method according to claim 14, wherein the element substrate includes a first terminal electrically connected to the energy generation element, and the electric wiring board includes a second terminal located side by side with the first terminal, wherein, in electrically connecting the element substrate and the electric wiring board, the first terminal and the second terminal are electrically connected by a connecting member, and wherein the electric connection portion includes the first terminal, the second terminal, and the connecting member. ### Claim 16 (depends on 14) The method according to claim 14, wherein the part facing the outer periphery of the element substrate in the cover member includes an inclined surface or a curved surface on which a distance to the outer periphery of the element substrate continuously changes, and wherein sealing the electric connection portion by the sealant includes enabling the sealant to move toward the element substrate along the inclined surface or the curved surface. ### Claim 17 (depends on 16) The method according to claim 16, wherein, in disposing the cover member, the cover member is fixed to the support member by an adhesive, and wherein, in sealing the electric connection portion by the sealant, the sealant moves along the inclined surface or the curved surface of the cover member, after the sealant that has flowed along the support member comes in contact with a tip on the element substrate side of the adhesive. ### Claim 18 (depends on 14) The method according to claim 14, wherein the part facing the outer periphery of the element substrate in the cover member includes a protrusion portion protruding to the element substrate side, and the protrusion portion includes the opposite surface, and wherein sealing the electric connection portion by the sealant includes enabling the sealant to move toward the element substrate along a surface on the support member side of the protrusion portion. ### Claim 19 (depends on 18) The method according to claim 18, wherein, in disposing the cover member, the cover member is fixed to the support member by an adhesive, and wherein, in sealing the electric connection portion by the sealant, the sealant moves along the surface on the support member side of the protrusion portion of the cover member, after the sealant that has flowed along the support member comes in contact with a tip on the element substrate side of the adhesive. ### Claim 20 (depends on 14) The method according to claim 14, wherein the part facing the outer periphery of the element substrate in the cover member includes a surface connected to the opposite surface and extending in a thickness direction.