Engineered materials for electronics assembly

A solder material for use in electronic assembly, the solder material comprising:

• solder layers;
• and
• a core layer comprising a core material, the core layer being sandwiched between the solder layers,
• wherein:
• the thermal conductivity of the core material is greater than the thermal conductivity of the solder.

A multilayered structure for use in electronic assembly, the multilayered structure comprising:

• two outer solder layers, each outer solder later comprising solder material;
• and
• a core layer sandwiched between the two outer solder layers,
• wherein:
• the core layer comprises two outer core sublayers and optionally one or more central core sublayers:
• the two core sublayers, and central core layers if present, being separated from each other by one or more solder layers:
• the outer core sublayers and inner core sublayers comprise core material:
• the core material of one outer core sublayer has a different coefficient of thermal expansion than the core material of the other outer core sublayer:
• and
• the thermal conductivity of the core materials is greater than the thermal conductivity of the solder materials.