Memory devices and methods of forming the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChen-Feng Hsu, Chien-Min Lee, Tung-Ying Lee, Cheng-Hsien Wu, Hengyuan Lee, Xinyu BAO
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChen-Feng Hsu, Chien-Min Lee, Tung-Ying Lee, Cheng-Hsien Wu, Hengyuan Lee, Xinyu BAO
Estimating the term…
A memory device includes a substrate, a transistor disposed over the substrate, an interconnect structure disposed over and electrically connected to the transistor, and a memory stack disposed between two adjacent metallization layers of the interconnect structure. The memory stack includes a bottom electrode disposed over the substrate and electrically connected to a bit line, a memory layer disposed over the bottom electrode, a selector layer disposed over the memory layer, and a top electrode disposed over the selector layer and electrically connected to a word line. Besides, at least one moisture-resistant layer is provided adjacent to and in physical contact with the selector layer, and the at least one moisture-resistant layer includes an amorphous material.
A method of forming a memory device, comprising:
A method of forming a memory device, comprising:
A method of forming a memory device, comprising:
Dependencies are inferred from the claim text.