Heat sink for liquid cooling

Abstract

A module is provided for housing electronic devices and a liquid coolant. The module comprises: a housing defining a sealable internal volume for containing the electronic devices and the liquid coolant, the sealable internal volume having a base; a substrate in the sealable internal volume approximately parallel to the base, one of the electronic devices being mounted on a side of the substrate proximal the base; and a heat sink device, comprising a receptacle part defining an internal volume that is arranged to receive the liquid coolant and accumulate the liquid coolant therein. The heat sink is mounted such that the one of the electronic devices or a component that is thermally conductively coupled to the one of the electronic devices is at least partially within the internal volume.

Dependencies are inferred from the claim text.