US 2024/0196563 A1 · LIQUID COOLING HEAT DISSIPATION STRUCTURE BASED ON DUAL COOLING PATHS

Abstract

A liquid cooling node is provided, the node includes a sealed compartment, a cooling component, two first connectors, and two second connectors. The sealed compartment is filled with a first medium. The cooling component is disposed in the sealed compartment, and the cooling component is filled with a second medium. The first connectors are disposed on a side wall of the sealed compartment, and are communicated with the sealed compartment to form a first cooling path. The second connectors are disposed on the side wall of the sealed compartment, and are communicated with the cooling component to form a second cooling path. In this application, a heat dissipation problem of a single high-power main chip can be resolved, so that an entire data center node maintains a low temperature for a long time.

Claims20

Dependent claims

A liquid cooling node, comprising:

a sealed compartment, wherein the sealed compartment is filled with a first medium;
at least one cooling component, disposed in the sealed compartment, wherein the cooling component is filled with a second medium;
two first connectors, disposed on a side wall of the sealed compartment, and configured to be communicated with the sealed compartment to form a first cooling path;
and
two second connectors, disposed on the side wall of the sealed compartment, and configured to be communicated with the at least one cooling component to form a second cooling path.

2 more elements

A liquid cooling heat dissipation cabinet, comprising:

a cabinet body;
a plurality of liquid cooling nodes, and the liquid cooling nodes are detachably installed on the cabinet body;
a first flow distribution unit, configured to distribute a first medium, wherein one of the first connectors of the liquid cooling node is communicated with a liquid inlet side of the first flow distribution unit, and the other one of the first connectors is communicated with a liquid outlet side of the first flow distribution unit;
and
a second flow distribution unit, configured to distribute a second medium, wherein one of the second connectors of the liquid cooling node is communicated with a liquid inlet side of the second flow distribution unit, and the other one of the second connectors is communicated with a liquid outlet side of the second flow distribution unit;
wherein, each liquid cooling node comprises:
a sealed compartment, wherein the sealed compartment is filled with a first medium;
at least one cooling component, disposed in the sealed compartment, wherein the cooling component is filled with a second medium;
two first connectors, disposed on a side wall of the sealed compartment, and configured to be communicated with the sealed compartment to form a first cooling path;
and
two second connectors, disposed on the side wall of the sealed compartment, and configured to be communicated with the at least one cooling component to form a second cooling path.

8 more elements

Dependencies are inferred from the claim text.

Liquid cooling heat dissipation structure based on dual cooling paths

Life of this patent

Liquid cooling heat dissipation structure based on dual cooling paths

Life of this patent

Abstract

Claims20