Printed wiring board

A printed wiring board, comprising:

• a laminate comprising a plurality of resin insulating layers and a plurality of conductor layers;
• and
• a plurality of via conductors formed in via holes of the resin insulating layers and each comprising a seed layer and an electrolytic plating layer formed on the seed layer such that the via conductors connect the conductor layers adjacent to each other and that the via conductors include a first via conductor and a second via conductor formed on the first via conductor in a lamination direction of the laminate,
• wherein the resin insulating layers include resin and inorganic particles such that the inorganic particles include first inorganic particles having smooth surfaces and second inorganic particles embedded in the resin insulating layers and that an inner wall surface of each of the via holes in the resin insulating layers includes the resin and the smooth surfaces of the first inorganic particles.