Adhesive for provisionally fixing electronic component to solder precoat and method for producing electronic component mounted substrate

A method for producing an electronic component mounting substrate, comprising steps of:

• preparing a circuit member having a solder precoat covered at least partially with an organic film;
• applying an adhesive for temporarily fixing an electronic component on the solder precoat, so as to cover at least part of the organic film;
• placing the electronic component on the solder precoat, with the adhesive interposed between the electronic component and the solder precoat;
• and
• reflowing the solder precoat, to mount the electronic component on the circuit member;
• wherein
• the adhesive includes a principal resin, and a solvent dissolving the principal resin,
• a content of the solvent is 25 mass % or more and 40 mass % or less, and
• the organic film dissolves in the solvent when the solder precoat is reflowed.