Printed circuit board assembly with reduced total height
AssigneeMediatek Inc.
InventorsChun-Ping Chen, Pei-San Chen, Hui-Chi Tang
Life of this patent
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Abstract
A printed circuit board assembly including a substrate having a first surface and a second surface opposite to the first surface, wherein the substrate has a first thickness; a cavity disposed within a chip module mounting region of the substrate on the first surface that caves in towards the second surface, wherein the chip module mounting region of the substrate has a second thickness, wherein the second thickness is smaller than the first thickness; a plurality of bonding pads in the cavity; and a chip module mounted in the cavity and electrically connected to the substrate through the plurality of bonding pads.
Claims20
A printed circuit board assembly, comprising:
- a substrate having a first surface and a second surface opposite to the first surface, wherein the substrate has a first thickness;
- a cavity disposed within a chip module mounting region of the substrate on the first surface that caves in towards the second surface, wherein the chip module mounting region of the substrate has a second thickness, wherein the second thickness is smaller than the first thickness;
- a plurality of bonding pads in the cavity;
- and
- a chip module mounted in the cavity and electrically connected to the substrate through the plurality of bonding pads.
A printed circuit board assembly, comprising:
- a substrate having a first surface and a second surface opposite to the first surface, wherein the substrate has a first thickness;
- a cavity disposed within a chip module mounting region of the substrate on the first surface that caves in towards the second surface, wherein the chip module mounting region of the substrate has a second thickness, wherein the second thickness is smaller than the first thickness;
- a plurality of bonding pads in the cavity;
- a chip module mounted in the cavity and electrically connected to the substrate through the plurality of bonding pads;
- a through hole disposed in the chip module mounting region of the substrate;
- and
- a heat sink disposed in the through hole and thermally coupled to the chip module.
Dependencies are inferred from the claim text.