Semiconductor package assembly
AssigneeMediatek Inc.
InventorsHui-Chi TANG, Pei-San CHEN, Shao-Chun HO, Bo-Jiun YANG
Life of this patent
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Abstract
A semiconductor package assembly is provided. The semiconductor package assembly includes a base, a semiconductor package, and a capacitor. The base has a top surface and a bottom surface. The semiconductor package is disposed on the top surface of the base. The capacitor is disposed on the semiconductor package and located between the semiconductor package and the base. The capacitor has a back surface located away from the semiconductor package. The back surface of the capacitor is higher than the bottom surface of the base and lower than the top surface of the base.
Claims20
A semiconductor package assembly, comprising:
- a base having a top surface and a bottom surface;
- a semiconductor package disposed on the top surface of the base;
- and
- a capacitor disposed on the semiconductor package and located between the semiconductor package and the base, wherein the capacitor has a back surface located away from the semiconductor package, and wherein the back surface of the capacitor is higher than the bottom surface of the base and lower than the top surface of the base.
A semiconductor package assembly, comprising:
- a base having a top surface;
- a semiconductor package disposed on the top surface of the base by conductive structures, wherein the conductive structures are connected between the top surface of the base and the semiconductor package;
- and
- a capacitor disposed on the semiconductor package and surrounded by the conductive structures, wherein the capacitor partially overlaps the base in a direction substantially parallel with the top surface of the base.
Dependencies are inferred from the claim text.