Printed circuit board
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsYoun Gyu Han, Jin Uk Lee, Jin Oh Park, Yong Duk Lee
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Abstract
A printed circuit board includes a first insulating layer; a connection via penetrating through at least a portion of the first insulating layer and having an upper surface exposed to an upper surface of the first insulating layer; a cavity penetrating through at least a portion of the first insulating layer and having the upper surface of the first insulating layer as a bottom surface of the cavity; a bridge disposed in the cavity and having a first bridge pad disposed on a lower side of the bridge; and a bonding layer including conductive particles connected to the connection via and the first bridge pad.
Claims20
A printed circuit board comprising:
- a first insulating layer;
- a connection via penetrating through at least a portion of the first insulating layer and having an upper surface exposed to an upper surface of the first insulating layer;
- a cavity penetrating through at least a portion of the first insulating layer and having the upper surface of the first insulating layer as a bottom surface of the cavity;
- a bridge disposed in the cavity and having a first bridge pad disposed on a lower side of the bridge;
- and
- a bonding layer including conductive particles connected to the connection via and the first bridge pad.
A printed circuit board comprising:
- a first insulating layer;
- a pad buried in an upper side of the first insulating layer and having a portion of a side surface and an upper surface protruding toward an upper surface of the first insulating layer;
- a cavity penetrating through a portion of the first insulating layer and having the upper surface of the first insulating layer as a bottom surface of the cavity;
- a bridge disposed in the cavity and having a first bridge pad disposed on a lower side of the bridge;
- and
- a bonding layer including conductive particles connected to the pad and the first bridge pad.
A printed circuit board comprising:
- a first insulating layer in which a first via is disposed;
- a second insulating layer which is disposed on the first insulating layer and in which a second via is disposed;
- a cavity penetrating through the second insulating layer and a portion of the first insulating layer;
- a bridge disposed in the cavity and having a bridge pad;
- and
- a bonding layer disposed between the first insulating layer and the bridge and including conductive particles disposed between the first via and the bridge pad,
- wherein the first via and the second via are tapered in a same direction.
Dependencies are inferred from the claim text.