Printed circuit board and manufacturing method thereof
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorKyehwan Lee
Life of this patent
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Abstract
A printed circuit board includes an insulation layer having a first surface and a second surface which are opposite to each other, a first connection pad which is embedded in the insulation layer and has a surface recessed from the first surface of the insulation layer, a conductive layer which is located on the first connection pad and has a part embedded in the insulation layer and another part protruding from the first surface of the insulation layer, and a first solder resist layer which is located on the first surface of the insulation layer and has a surface which is at a level equal to or lower than a surface of the conductive layer.
Claims38
A printed circuit board, comprising:
- an insulation layer having a first surface and a second surface which are opposite to each other;
- a first connection pad which is embedded in the insulation layer and has a surface recessed from the first surface of the insulation layer;
- a conductive layer which is located on the first connection pad and has a part embedded in the insulation layer and another part protruding from the first surface of the insulation layer;
- and
- a first solder resist layer which is located on the first surface of the insulation layer and has a surface which is at a level equal to or lower than a surface of the conductive layer.
A manufacturing method of a printed circuit board, comprising:
- forming an embedded pattern substrate including a first connection pad embedded in an insulation layer having a first surface and a second surface which are opposite to each other;
- forming a first solder resist layer on the first surface of the insulation layer to cover the first connection pad;
- patterning a first opening in the first solder resist layer to expose the first connection pad;
- forming a conductive layer in the first opening by performing a plating process;
- and
- thinning the first solder resist layer.
A printed circuit board, comprising:
- an insulation layer having a first surface and a second surface which are opposite to each other;
- a first solder resist layer disposed on the first surface of the insulation layer;
- a first connection pad embedded in the insulation layer;
- and
- a conductive layer including a nickel (Ni) conductive layer disposed on the first connection pad and a gold (Au) conductive layer disposed on the nickel (Ni) conductive layer,
- wherein at least portions of the nickel (Ni) conductive layer and the gold (Au) conductive layer protrude from an upper surface of the first solder resist layer.
A printed circuit board, comprising:
- an insulation layer having a first surface and a second surface which are opposite to each other;
- a first connection pad embedded in the insulation layer;
- a second connection pad disposed on the second surface of the insulation layer and connected to the first connection pad through a via;
- a first conductive layer disposed on the first connection pad;
- a second conductive layer disposed on the second connection pad;
- a first solder resist layer disposed on the first surface of the insulation layer;
- and
- a second solder resist layer disposed on the second surface of the insulation layer,
- wherein at least a portion of a side surface of the first conductive layer is exposed from an upper surface of the first solder resist layer.
Dependencies are inferred from the claim text.