Printed circuit board

A printed circuit board, the board comprising:

• an organic insulating layer;
• a conductor pad disposed below the organic insulating layer;
• a wiring layer disposed on the organic insulating layer;
• and
• a conductor via penetrating through the organic insulating layer and connecting the wiring layer to the conductor pad,
• wherein the wiring layer comprises a first seed metal layer including a first sputtering layer having titanium (Ti), a second seed metal layer disposed on the first seed metal layer and including an electroless plating layer, and a metal layer disposed on the second seed metal layer and including an electrolytic plating layer, and
• the conductor via includes the second seed metal layer and the metal layer.

A printed circuit board, the board comprising:

• a first metal layer;
• an organic insulating layer disposed on the first metal layer;
• a second metal layer disposed on the organic insulating layer;
• a via protruding from a lower surface of the second metal layer and disposed in a via hole penetrating through the organic insulating layer;
• a first seed metal layer including a first sputtering layer having titanium (Ti) and comprising at least a portion disposed between an upper surface of the organic insulating layer and the lower surface of the second metal layer;
• and
• a second seed metal layer including an electroless plating layer and comprising at least a portion disposed between a wall surface of the via hole and the via.