Wiring substrate

A wiring substrate, comprising:

• a plurality of insulating layers comprising inorganic particles and resin;
• a plurality of conductor layers formed on first surfaces of the plurality of insulating layers, respectively, and including an outermost conductor layer and a conductor layer;
• and
• a plurality of via conductors formed in the plurality of insulating layers such that the plurality of via conductors is connecting the plurality of conductor layers formed on the first surfaces of the insulating layers,
• wherein the plurality of conductor layers is formed such that the outermost conductor layer includes a plurality of first conductor pads positioned to mount a first component and a plurality of second conductor pads positioned to mount a second component and that the conductor layer includes a plurality of first wiring patterns connecting the first conductor pads and the second conductor pads, and the plurality of insulating layers is formed such that the first surfaces of the insulating layers are formed of the resin and do not have exposed surfaces of the inorganic particles.