Printed circuit board with electromagnetic bandgap structure for launcher in package devices
AssigneeNXP B.V.
InventorsManuel Alfredo MONEDERO MIRANDA, Holger KUHNERT
Life of this patent
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Abstract
A Launcher in Package (LiP) device for wireless communications, e.g., radar communications at 77 GHz, includes a printed circuit board (PCB) arranged between a radio frequency (RF) chip package and a radiating antenna structure. The PCB include an electromagnetic bandgap (EBG) structure including a plurality of EBG elements printed in a periodic pattern on the side of the PCB facing the radiating antenna structure. The plurality of EBG elements border at least one side of an RF channel through the PCB that couples an antenna element of the radiating antenna structure with a corresponding RF launcher in the RF chip package.
Claims20
A printed circuit board (PCB) for a launcher in package (LiP) device, the PCB comprising:
- a first surface that faces an integrated circuit (IC) chip package of the LiP;
- a second surface that faces an antenna structure of the LiP;
- and
- an electromagnetic bandgap (EBG) structure on the second surface, the EBG structure comprising a plurality of EBG elements.
A Launcher in Package (LiP) device, comprising:
- a radio frequency (RF) integrated circuit (IC) chip package with a plurality of RF launchers;
- an antenna structure with a plurality of antenna elements, each antenna element of the plurality of antenna elements corresponding to a respective RF launcher of the plurality of RF launchers;
- and
- a printed circuit board (PCB) between the RF IC chip package and the antenna structure, the PCB comprising an electromagnetic bandgap (EBG) structure on a side of the PCB facing the antenna structure, wherein the EBG structure comprises a plurality of EBG elements.
A method to manufacture a Launcher in Package (LiP) device, comprising:
- on a printed circuit board (PCB) located between a radio frequency (RF) integrated circuit (IC) chip package and an antenna structure of the LiP device, printing an electromagnetic bandgap (EBG) structure on a surface of the PCB facing the antenna structure, wherein the EBG comprises a plurality of EBG elements.
Dependencies are inferred from the claim text.