Circuit board with embedded electronic component and manufacturing method thereof

A manufacturing method of a circuit board, comprising:

• providing a circuit substrate, wherein the circuit substrate comprises an insulating substrate and an electronic component embedded in the insulating substrate, the insulating substrate defines two first slots to partially expose the electronic component;
• filling a first phase change material in the two first slots, causing the first phase change material to thermally connect to the electronic component;
• forming a first wiring layer on a surface of the insulating substrate, causing the first wiring layer to cover the two first slots and thermally connect to the first phase change material;
• forming a second wiring layer on another surface of the insulating substrate, wherein the second wiring layer comprises a plurality of wiring portions and a wiring slot formed between adjacent two of the plurality of wiring portions, the electronic component is electrically connected to the second wiring portion;
• and
• filling a second phase change material in at least one of the wiring slot, causing the second phase change material to thermally connect a portion of the plurality of wiring portions together to form a heat dissipation zone.