Multiple membrane thickness wafers using layer transfer acoustic resonators and method of manufacturing same
AssigneeMurata Manufacturing Co., Ltd.
InventorsDouglas JACHOWSKI, Patrick TURNER, Chris O'BRIEN
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AssigneeMurata Manufacturing Co., Ltd.
InventorsDouglas JACHOWSKI, Patrick TURNER, Chris O'BRIEN
Estimating the term…
An acoustic resonator is provided that includes a substrate; a first piezoelectric layer having first and second surfaces that oppose each other, with the second surface coupled to the substrate directly or via one or more intermediate layers; a second piezoelectric layer having first and second opposing surfaces, with the first surface coupled to the first surface of the first piezoelectric layer and opposite to the substrate; an etch stop layer disposed between the respective first surfaces of the first and second piezoelectric layers; and first and second interdigital transducers (IDTs) on at least one of the first and second piezoelectric layers, respectively. Moreover, a portion of one of the first and second piezoelectric layers is removed between the second surface of the respective piezoelectric layer and the etch stop.
An acoustic resonator, comprising:
An acoustic resonator, comprising:
A radio frequency module, comprising:
Dependencies are inferred from the claim text.