Piezoelectric plate and manufacturing method therefor, saw device and manufacturing method therefor

Abstract

Disclosed are a piezoelectric plate and a manufacturing method therefor, an SAW device and a manufacturing method therefor. The manufacturing method for the piezoelectric plate provided in the present disclosure includes: sequentially growing a piezoelectric material layer and a protective layer on a first substrate, bonding the protective layer to a second substrate, and then peeling off the first substrate to form a piezoelectric plate including the second substrate, the protective layer and the piezoelectric material layer from bottom to top. A lattice constant of the protective layer is greater than a lattice constant of the piezoelectric material layer. Probability of occurrence of a crack in the piezoelectric material layer may be reduced by the protective layer. Stress generated by lattice mismatch and thermal mismatch is released by transfer of the substrate, so that an occurrence of a crack of the piezoelectric material layer may be avoided.

Dependencies are inferred from the claim text.