Emitter assembly with locking pins

An emitter assembly, comprising:

• a vertical cavity surface emitting laser (VCSEL) chip comprising a plurality of VCSELs in a bottom-emitting configuration,
• wherein the plurality of VCSELs are respectively associated with a plurality of first electrical contacts;
• a carrier having a plurality of second electrical contacts,
• wherein the VCSEL chip is in a flip chip configuration with the carrier;
• a plurality of conductive pillars that electrically connect the plurality of first electrical contacts and the plurality of second electrical contacts,
• wherein a conductive pillar, of the plurality of conductive pillars, has a solder cap at an end of the conductive pillar;
• and
• a pin extending from one of the VCSEL chip or the carrier into the solder cap.

A method, comprising:

• assembling a vertical cavity surface emitting laser (VCSEL) chip in a flip chip configuration with a carrier to produce an emitter assembly,
• wherein a plurality of conductive pillars electrically connect the VCSEL chip and the carrier,
• wherein a conductive pillar, of the plurality of conductive pillars, has a solder cap at an end of the conductive pillar, and
• wherein one of the VCSEL chip or the carrier comprises a pin for the solder cap;
• and
• performing a solder reflow procedure on the emitter assembly.